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A green approach to synthesis of nanoparticles of Sn-3.0Ag-0.5Cu lead-free solder alloy

机译:Sn-3.0Ag-0.5Cu无铅焊料合金纳米粒子的绿色合成方法

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摘要

Sn-3.0Ag-0.5Cu nanoparticles can provide a potential solution to the high soldering temperature problem of lead-free solder alloy because the nanosize effect can depress the melting temperature. In this paper, a green approach to the synthesis of Sn-3.0Ag-0.5Cu nanoparticles by chemical reduction at room temperature is reported. A safe organic solvent, ethanol, was used to prevent the formation of tin oxide during synthesis without the help of capping agents and N-2 purging. Vigorous stirring instead of the use of capping agents was applied to the reaction mixture to reduce agglomeration of particles during the reaction time. Owing to not having capping agents on the nanoparticles and no detection of tin oxide, the subsequent steps for eliminating them are not necessary. Ag3Sn revealed by the XRD pattern and the electron diffraction pattern confirmed the successful alloying of Sn and Ag during synthesis. The TEM image showed that the nanoparticles were composed of a crystalline core embedded by an amorphous matrix. The average particle diameter was 53.3 nm with a standard deviation of 8.9 nm. An onset melting temperature of 187.3 degrees C and a peak melting temperature of 212.7 degrees C were achieved. This simple, safe and environmentally friendly method can reduce the production cost of nanosolder and may be applicable to the synthesis of other metal nanoparticles.
机译:Sn-3.0Ag-0.5Cu纳米颗粒可以为无铅焊料合金的高焊接温度问题提供潜在的解决方案,因为纳米尺寸效应可以降低熔化温度。本文报道了一种在室温下通过化学还原合成Sn-3.0Ag-0.5Cu纳米粒子的绿色方法。使用安全的有机溶剂乙醇,可在合成过程中防止氧化锡的形成,而无需使用封端剂和N-2吹扫。对反应混合物进行剧烈搅拌而不是使用封端剂,以减少反应期间颗粒的团聚。由于在纳米颗粒上没有封端剂并且没有检测到氧化锡,因此消除它们的后续步骤不是必需的。 XRD图谱和电子衍射图谱揭示的Ag3Sn证实了合成过程中Sn和Ag的成功合金化。 TEM图像表明,纳米颗粒由嵌入非晶基质的结晶核组成。平均粒径为53.3nm,标准偏差为8.9nm。起始熔融温度为187.3℃,峰值熔融温度为212.7℃。这种简单,安全和环保的方法可以降低纳米焊料的生产成本,并且可以应用于合成其他金属纳米颗粒。

著录项

  • 作者

    Pang, SK; Yung, KC;

  • 作者单位
  • 年度 2012
  • 总页数
  • 原文格式 PDF
  • 正文语种 en
  • 中图分类
  • 入库时间 2022-08-20 20:56:17

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